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Press Releases
ASMPT Announces 2026 First Quarter Results Strong Demand Driven by AI
ASMPT wins JSD as a new distributor
ASMPT SMT Solutions continues to expand its sales and service organization in the U.S. market
WORKS Monitoring from ASMPT
More transparency and accuracy in SMT production
ASMPT looking back on a successful APEX EXPO 2026
SIPLACE V strikes a chord with the U.S. market
ASMPT at OFC 2026 Los Angeles - Enabling scalable co-packaged optics and photonic integration
ASMPT Announces 2025 Annual Results AI-Driven Structural Growth Underpins Group Performance
New analytics functions in SMT Analytics from ASMPT SMT Solutions
AI-supported analyses increase transparency and line throughput
ASMPT Extends Technology Leadership With Key TCB AOR Chip-To-Wafer Milestone
ASMPT to show intelligent manufacturing solutions at APEX EXPO 2026
We boost your intelligent factory
ASMPT Announces Assessment of Strategic Options for SMT Solutions Segment
New placement platform from ASMPT SMT Solutions
A new era: The SIPLACE V platform
ASMPT SMT Solutions and Shinwa launch cooperation at NEPCON Japan 2026
Strong partnership for innovative Advanced Packaging technologies
ASMPT presents optimized Odd Shaped Component (OSC) Package
Mastering OSCs for maximum competitive advantage
ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
ASMPT at Productronica 2025
Beginning of a new era: ASMPT takes off
ASMPT Announces 2025 Third Quarter Results Strong Momentum Driven by AI
ASMPT at Productronica 2025
A new era in semiconductor and electronics production
Launch of the ASMPT SMT Customer Portal
Digital services centrally bundled for intelligent manufacturing
ASMPT at productronica India
Transform your SMT production with ASMPT
Intelligent alternative-component solution from ASMPT and Viscom for Schaeffler AG
Different supplier, same process
ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology
ASMPT at SEMICON West 2025 Showcasing Advanced Packaging Solutions for AI and High-Performance Computing
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
ASMPT Introduces ALSI LASER1206 - Fully Automatic Laser Dicing and Grooving
ASMPT Joins "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
WORKS Optimization from ASMPT
Intelligent process optimization along the entire line
ASMPT Announces Strategic Optimisation of its Manufacturing Operations
ASMPT Announces 2025 Interim Results Strong Demand Driven By AI Tailwinds
ASMPT presents software duo for seamlessly automated material flow optimization
Maximum uptime with 100-percent transparency
Toni Patzner becomes Global Head of Supply Chain Management at ASMPT SMT Solutions
Focused on lean structures
ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey
WORKS Integration – the data center for intelligent manufacturing
ASMPT presents central platform for data exchange in electronics manufacturing
ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise
ASMPT demonstrates technology leadership in SMT assembly
Zero DPMO – in every dimension
Dr. Thomas Marktscheffel of ASMPT honored for his work on open interfaces
IPC President's Award
New stationary camera for SIPLACE placement machines
Fast, flexible, high-resolution
New Managing Director at ASMPT SMT Solutions for the Asia region (excluding China)
DaeSung Kim takes over Sales and Service Organization
ASMPT at IPC APEX EXPO 2025
Component flexibility from the technology leader
Techman Robot and ASMPT Sign MOU to Accelerate Intelligent Manufacturing Innovations
PCBs trigger program downloads on the SMT line
Seamless program changeovers – now also across setups
Katie Xu Promoted to Executive Vice President, Strengthening ASMPT’s Financial Leadership
ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running
ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
ASMPT announces key global and SMT leadership changes to prepare it for the future
ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future
Leading semiconductor & electronics equipment maker aligns all units globally under ‘ASMPT’ brand
Joint Development between ASTRI, ASMPT And Alpha Power Solutions
ASMPT And Tianshui Huatian Electronic Group Signed Letters Of Intent
ASMPT And Tianshui Huatian Electronic Group Signed Letters Of Intent
ASM Pacific Technology Earns Triple Crown For The Second Year
ASM Pacific Technology Earns Triple Crown For The Second Year
ASM Pacific Technology Recognized As Top 100 Global Tech Leaders
ASM Pacific Technology Recognized As Top 100 Global Tech Leaders
ASM Pacific Technology Won The “Directors Of The Year Awards 2017”
ASM Pacific Technology Won The “Directors Of The Year Awards 2017”
ASM Pacific Technology Named “Hong Kong Outstanding Enterprise”
ASM Pacific Technology Named “Hong Kong Outstanding Enterprise”
ASM Pacific Technology Opens Second Building And New Innovation Centre
ASM Pacific Technology Opens Second Building And New Innovation Centre
ASM Pacific Technology wins all 3 awards by VLSIresearch Award Once Again
ASM Pacific Technology wins all 3 awards by VLSIresearch Award Once Again
Co-Presentation Of A White Paper On Thermo Compression Bonding
Co-Presentation Of A White Paper On Thermo Compression Bonding
ASM Response To Coverage On Staff Suicide In Shenzhen Factory
ASM Response To Coverage On Staff Suicide In Shenzhen Factory
ASM Pacific Technology Concludes Acquisition Of SEAS Business


















































