MEGA
The New Standard in Multi-Chip Packaging Excellence
Revolutionizing Multi-Chip Packaging with Precision and Efficiency
The MEGA is a cutting-edge multi-chip bonder, specifically engineered for the production of advanced semiconductor packages. This technology integrates multiple chips into a single package, offering a high-precision solution for the diverse needs of modern electronics. With a placement accuracy of ±5 μm in high-speed mode and up to 14,000 units per hour (UPH), the MEGA is designed to meet the growing demands of high-performance computing, AI systems, and wireless communications.
Key Features for Future-Ready Manufacturing
- High-Speed Bonding for Complex Packages
Multi-chip packaging is critical for creating compact, high-performance components essential for modern electronic devices. The MEGA tackles the challenges of increasing semiconductor complexity with its innovative bonding technology, supporting various processes including epoxy dispensing, stamping, and UV curing. - Exceptional Precision and Flexibility
Precision is paramount for advanced packaging in semiconductor technology. The MEGA achieves a placement accuracy of ±5 μm in high-speed mode and ±10 μm in ultra-high-speed mode, processing up to 14,000 UPH. This makes it an ideal solution for high-mix production, including RF devices, photonics, and wearable system-in-package (SiP) applications. - Advanced Vision and Control Systems
Equipped with patented look-through pattern recognition technology, the MEGA ensures precise alignment and final inspection. Its modular design allows for customization to meet specific package requirements, while the advanced bond line thickness (BLT) control ensures consistent quality. - Efficient Resource Utilization
The MEGA's visionary approach of adopting one machine to replace an entire production line heralds a new era of efficiency and resource conservation. By streamlining operations, it optimizes facility space and champions electrical energy conservation, marking a significant stride towards greener manufacturing practices. - Flexible Technology for a Range of Applications
The MEGA's flexibility extends to supporting various die sizes from 0.15 x 0.15 mm to 10 x 10 mm, and substrate sizes up to 130 x 300 mm (with options for larger sizes). This versatility, coupled with features like auto bond-tool change and high flexibility wafer input, makes it a powerful tool for a wide range of applications in the semiconductor industry.
Shaping the Future of Semiconductor Packaging
Multi-chip bonding is essential for next-generation technologies where maximum performance in minimal space is crucial. As the complexity of electronic devices increases, the MEGA's precision in placing and bonding multiple chips positions it as a key player in the evolution of advanced semiconductor packaging.
MEGA’s Advanced manufacturing capabilities enable next-generation semiconductor production by combining efficiency, precision, and sustainability in comprehensive packaging solutions.