Integrated Solutions
Whatever cutting-edge manufacturing technology is required to bring ground-breaking electronic products to market across a wide range of industries, ASMPT delivers it with unequalled expertise and integrated solutions.
News & Highlights
At ASMPT, we are changing electronics and semiconductor manufacturing with intelligent, customer-driven innovations. Our goal is to provide leading-edge solutions that exceed industry standards. Innovation drives us.
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NEW: SIPLACE V – a new era begins in SMT manufacturing
The newly designed SIPLACE V placement platform combines leading performance, maximum flexibility and highest precision with full compatibility to existing SMT lines. At the same time, it is consistently designed to meet the requirements of the future – for further automation, efficient big data processing and long-term investment security.
NEW: ALSI LASER1206 - Modular Laser Dicing Solution
The new cutting-edge multi-beam laser dicing platform addresses the growing demand from semiconductor companies specializing in advanced packaging to deliver solutions for growth markets such as AI and smart mobility.
Placement of Large, Heavy and Complex BGAs
AI and high-performance computing drive increasing demands for placing oversized, irregular components. ASMPT meets these challenges with pioneering SMT placement technologies that set new multisize benchmarks.
White Paper
Maximizing uptime with 100% visibility
Seamless automated material flow optimization in the intelligent factory
The Solution for the Next Generation of Semiconductors
The FIREBIRD TCB is a state-of-the-art thermos-compression bonding system specifically designed for heterogeneous integration in 2D, 2.5D and 3D formats.





