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Enabling the digital world

Integrated Hardware and Software Solutions for Semiconductor and Electronics Manufacturing

The digital transformation is changing everything. Communication and IT, intelligent vehicles and e-mobility, medical technology, consumer and industrial electronics –

any device containing electronics has probably been developed or built using ASMPT's solutions.

We are enabling the digital world.

Integrated Solutions

Whatever cutting-edge manufacturing technology is required to bring ground-breaking electronic products to market across a wide range of industries, ASMPT delivers it with unequalled expertise and integrated solutions.

More about our Semiconductor Solutions

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Annual
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2024

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Environmental,
Social and Governance
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News & Highlights

At ASMPT, we are changing electronics and semiconductor manufacturing with intelligent, customer-driven innovations. Our goal is to provide leading-edge solutions that exceed industry standards. Innovation drives us.

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NEW: SIPLACE V – a new era begins in SMT manufacturing

The newly designed SIPLACE V placement platform combines leading performance, maximum flexibility and highest precision with full compatibility to existing SMT lines. At the same time, it is consistently designed to meet the requirements of the future – for further automation, efficient big data processing and long-term investment security.

NEW: ALSI LASER1206 - Modular Laser Dicing Solution

The new cutting-edge multi-beam laser dicing platform addresses the growing demand from semiconductor companies specializing in advanced packaging to deliver solutions for growth markets such as AI and smart mobility.

White Paper

Placement of large and heavy BGAs

From small sizes to new dimensions

Placement of Large, Heavy and Complex BGAs

AI and high-performance computing drive increasing demands for placing oversized, irregular components. ASMPT meets these challenges with pioneering SMT placement technologies that set new multisize benchmarks.

White Paper

Maximizing uptime with 100% visibility

Seamless automated material flow optimization in the intelligent factory

The Solution for the Next Generation of Semiconductors

The FIREBIRD TCB is a state-of-the-art thermos-compression bonding system specifically designed for heterogeneous integration in 2D, 2.5D and 3D formats. 

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Shape the Digital Future with Us

Join our global technology company and work on innovations that are transforming the digital world.

Our employees are the key to our success, and we offer you flexible and modern work models, development opportunities, and an environment that fosters diversity, creativity and technological excellence.

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