Integrated Solutions
Whatever cutting-edge manufacturing technology is required to bring ground-breaking electronic products to market across a wide range of industries, ASMPT delivers it with unequalled expertise and integrated solutions.
News & Highlights
At ASMPT, we are changing electronics and semiconductor manufacturing with intelligent, customer-driven innovations. Our goal is to provide leading-edge solutions that exceed industry standards. Innovation drives us.
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The Solution for the Next Generation of Semiconductors
The FIREBIRD TCB is a state-of-the-art thermos-compression bonding system specifically designed for heterogeneous integration in 2D, 2.5D and 3D formats.
Revolutionizing Multi-Chip Packaging with Precision and Efficiency
The MEGA is a cutting-edge multi-chip bonder, specifically engineered for the production of advanced semiconductor packages. This technology integrates multiple chips into a single package, offering a high-precision solution for the diverse needs of modern electronics.
The LITHOBOLT™ is the Future of Semiconductor Integration.
The LITHOBOLT™ represents the new standard in die-to-wafer hybrid bonding technology, designed to meet the demands of next-generation semiconductor packaging.
ALSI LASER1205 Shapes the Future of Power Electronics
This cutting-edge multi-beam laser dicing platform sets new standards in wafer separation technology. Engineered for silicon carbide (SiC) and other advanced semiconductor materials, this innovative system delivers precision and performance that is unparalleled in the industry.
Data-Driven Quality: Setting the Highest Standards in Electronics Manufacturing
As a leading provider of SMT manufacturing solutions, ASMPT uses big data to optimize processes by analyzing real-time data from machines and systems. Deviations are detected immediately and often automatically corrected, reducing reject rates and costs while increasing productivity and profitability.
Game-Changing Software Redefines Intralogistics in the Intelligent Electronics Factory
By using real-time data and seamless connectivity, ASMPT's intelligent material flow solutions transform intralogistics into a synchronized, efficient and transparent process, ensuring optimal production performance with reduced costs, minimized errors and maximum flexibility.
IoT Data Platform
Designed specifically for manufacturing, the Critical Manufacturing IoT Data Platform is a complete, highly scalable solution that combines IoT, equipment integration, data processing and analytics with contextual intelligence from MES.
Hybrid SIPLACE CA2 High-Speed Platform Revolutionizes SiP Production
The hybrid placement machine SIPLACE CA2 combines high-speed chip assembly directly from the wafer with SMT placement in the same work step at speeds of up to 50,000 dies or 76,000 SMT components per hour with a precision of up to 10 microns @ 3 σ.
NEW: AMICRA NANO Boosts the Data Highways of the Future
The AMICRA NANO die and flip-chip bonder is specifically designed for the production of co-packaged optics, where optical and electronic components are integrated into a single package with the highest precision.
Dr. Gary Widdowson
Chief Technical Officer, ASMPT SEMI Solutions
Learn more from Gary about innovations at SEMI Solutions in the video.
Thomas Bliem
Head R&D, ASMPT SMT Solutions
Learn more from Thomas about innovations at SMT Solutions in the video.
Shaping a Bright and Sustainable Future
As the leading technology company, we see it as our mission to set the standard in ESG (environmental, social, governance). We're dedicated to driving sustainability and making a positive impact, leading by example across the industry. Sustainability is at the heart of everything we do, and we take this responsibility seriously. We are committed to “shaping a bright and sustainable future for customers, employees, investors, partners, and society.” More about sustainability at ASMPT in our latest ESG Report
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