Group Structure
Semiconductor Solutions
- Die bonders
- Wire bonders
- Laser grooving and dicing
- Metrology
- Automated Optical Inspection (AOI)
- Test handlers
- Clip bonders
- CIS equipment
- TCB bonders
- Flip chip bonders
- Mold Under Fill (MUF)
- Silver Sintering
- Panel molding
- Encapsulation solutions
- Singulation, Trim & Form
- Inspection, Test & Packing
SMT Solutions
- Assembly line solutions
- DEK printing systems
- SIPLACE placement systems
- ASMPT smart factory tools & services