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The SIPLACE CA hybrid placement machine can also place components directly from the pre-separated wafer, saving tons of tape waste.

Avoiding Waste during Component Feeding

SMT and die assembly continues to generate large quantities of packaging waste. This is mainly generated during production by the material belts: disposable containers made of various plastics, which are often difficult to recycle. ASMPT is breaking new ground in waste avoidance. A good example of this is the SIPLACE CA placement machine, which can pick up and place dies directly from pre-separated wafers. This not only eliminates a complete work step, the taping of the dies, but also saves many tons of waste. In the SMT sector, tray units are on the rise, which no longer feed the components from component reels and blisters, but from bar and surface magazines – another important contribution to environmentally friendly and sustainable production.

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