Flexible, Fast and Precise Die Bonding with AMICRA NOVA Pro

The new version of the AMICRA NOVA Pro is one of the most advanced die bonding systems. The platform combines high placement accuracy with short cycle times and innovative bonding technologies for zero DPMO in a highly efficient and energy-saving production process. The AMICRA NOVA Pro ensures its trend-setting placement accuracy with its unique dynamic alignment method in combination with laser-based substrate heating technology. Thanks to its Active Bond Force Control, the machine can dose bonding forces with exceptional precision. Using an epoxy resin stamp with volumetric dosing, the dies can be affixed with adhesives that get UV-cured in place. The AMICRA NOVA Pro is the ideal technology to produce for example active optical cables for 400/800 Gigabit/sec networks or co-packaged optics. The AMICRA NOVA Pro is the ideal solution for connectivity applications in the field of future-oriented e-mobility.