Co-Presentation Of A White Paper With The World’s Leading IDM On Thermo Compression Bonding (TCB) At SEMICON Taiwan

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We are pleased to announce that ASM Pacific Technology (ASMPT) and our leading TCB customer (the world’s leading integrated IDM) will co-present a white paper in SEMICON Taiwan’s Advanced Packaging symposium on Sept 3, 2014 titled: “Thermo-Compression Bonding (TCB) for fine-pitch copper pillar flip chip interconnect”

This white paper will introduce a proven high quality flux TCB process used in high precision, high volume manufacturing of large die on advanced wafer nodes. This paper will also introduce proven portable module solutions / core technologies to address challenges of TCB process.

The white paper demonstrates our customer’s advanced interconnect process and application know-how. It also showcases ASMPT’s automation competency and her ability to bring TCB solutions to the broader market

SW Lau, General Product Manager of ASMPT (TCB applications), remarked, "Working with our leading customer in TCB bonding to deliver high quality bonds on advanced wafer nodes has been a significant milestone in our advanced application roadmap. The strategic value to our customer is to drive down the cost of ownership continuously, by enabling wider adoption on a future proof platform that is forward compatible with ever reducing wafer nodes applications."