ASM Pacific Technology Reaches Milestone With 250th Thermo-Compression Bonding Tool Shipped To Customers

Semiconductor and Packaging Technology Leader Extends Leadership in Advanced Packaging and Heterogeneous Integration with High Volume Manufacturing Tools

SINGAPORE 26 Feb 2021 – ASM Pacific Technology (ASMPT), a leading global supplier of hardware and software solutions for the manufacturing of semiconductors and electronics, announced that it has shipped its 250th Thermo-Compression Bonding (TCB) tool to customers in Feb 2021.

This milestone highlights ASMPT’s leadership in TCB, a technology it has heavily invested in innovation and co-pioneered with a leading customer, in order to deliver a reliable high volume manufacturing (HVM) tool to the market. Presently, ASMPT is in its 3rd generation of TCB bonders for the TC-CUF (Thermo-Compression-Capillary Underfill) process, which the company has progressively evolved from chip-to-substrate (C2S), chip-to-wafer (C2W) to the current ultra-precision, high throughput tool that is scalable for future needs of the industry and customers. With traditional mass reflow flip chip (MR FC) technology reaching the limits of its capabilities, ASMPT’s TCB technology continues to support its customers’ technology roadmaps in High-Performance Computing and adjacent applications. By ASMPT’s internal market assessment, the company believes it has the largest installed base of TCB tools and customers in the world and is a clear leader in the TC-CUF and TCB bonder market.

“Thanks to close collaboration with our lead customers, we have very extensive experience with TCB technology and are deeply privileged to be chosen by our customers as the preferred TCB tool for the TC-CUF process” explained Mr. Lim Choon Khoon, CEO of ASMPT’s IC/Discrete & CIS Business Unit, Semiconductor Solutions Segment. “We are committed to push technological boundaries and process capabilities with our next-generation tools that enable exponential scaling in chip interconnect that can directly address our customers’ Advanced Packaging and Heterogeneous Integration requirements.”

Since 2013, ASMPT has been able to enable high volume TC-CUF manufacturing. ASMPT is confident that with the advent of its new platform, it will continue to renew its value proposition by continuing to improve capabilities in precision, speed, reliability, and scalability, in order to help sustain its leadership in the TC-CUF space.

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About ASM Pacific Technology Limited (“ASMPT”)
ASMPT (HKEX stock code: 0522) is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition, to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability and enhanced quality.

ASMPT is one of the constituent stocks of the Hang Seng TECH Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, and the Hang Seng Hong Kong 35 Index. To learn more about ASMPT, please visit us at www.asmpacific.com.

For media enquiries:
Lim Ee Guan
Director, Corporate Communications
Tel: +65 6450 1445
Email: eg.lim@asmpt.com

On behalf of ASMPT:
Strategic Financial Relations Limited
Mandy Go / Antonio Yu / Cara Lau
Tel: 2864 4812 / 2114 4319 / 2864 4890
Fax: 2527 1196
Email: mandy.go@sprg.com.hk / antonio.yu@sprg.com.hk / cara.lau@sprg.com.hk