Taiwan, 19 January 2018 – In recent years, driven by the increased connectivity, sophisticated data-gathering and analytics capabilities enabled by the Internet of Things (IoT) have led to a shift toward an information-based economy. With these waves of change reshaping the technology landscape, the market will need more advanced semiconductor products to meet the global demand. This has led to ASM Pacific Technology Ltd. (ASMPT), a world leader in the supply of semiconductor assembly and packaging equipment and materials, as well as surface mount technology applications to ride on the current trend as it announced today the opening of its Research & Development Center in Taiwan.
The R&D Center which houses mainly the software engineers will focus on research and development of technologically leading products and solutions that are customizable accordingly to the customers’ needs for Industry 4.0 projects and smart factories. The R&D Center will also represent potential opportunities to bridge closer collaborations between ASMPT and its industry partners in the exchange of ideas and knowledge.
Said ASMPT’s CEO Mr. Lee Wai Kwong “One of our key successes is built on our ability to deliver innovative products with differentiated values to our customers. We invested a total of US$180 million dollars last year on technology research. The opening of Taiwan R&D Center further affirms our commitment towards Research and Development in supporting the Group’s future growth.”
Mr. Lee continued, “The Group was recently ranked in the 2018 Thomson Reuters Top 100 Global Technology Leaders alongside with other technology top players such as Apple, Accenture, Cisco, IBM, ACER, ASE, SPIL, ASUS, Liteon, PTI, UMC and TSMC in Taiwan etc. Being the only company based in Hong Kong, this firmly attests to the Group's solid foundation in financial performance, innovation, investor confidence, reputation and risk resilience etc.”
Besides able to provide immediate hands-on support to the Taiwan customers, the availability of large pool of highly qualified engineering talent, reputable universities and research institutes, as well as strong government support are some of the key reasons that attracted ASMPT to Taiwan. With this new setup, ASMPT now has seven R&D centers which include China (Chengdu), Hong Kong, Singapore, Germany (Munich), United Kingdom (Weymouth) and The Netherlands (Beuningen) around the world. ASMPT also operates in more than 30 countries including ten manufacturing facilities in China (i.e. Shenzhen, Huizhou and Hong Kong), Germany, Malaysia, Singapore, the Netherlands and United Kingdom.
Currently ASMPT employs a total of 1,800 professional engineers worldwide and is expected to hire up to 100 R&D professionals for the Taiwan R&D Center in the next three years.
Other news
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- ASMPT Announces 2024 Interim Results Advanced Packaging: Strong Order Momentum
- ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running
- ASMPT Announces 2024 Third Quarter Results TCB Momentum For HBM Intensifies
- Katie Xu Promoted to Executive Vice President, Strengthening ASMPT’s Financial Leadership
- ASMPT Announces 2024 First Quarter Results Book-to-Bill Ratio Above One QoQ Bookings Growth Driven by Advanced Packaging
- ASMPT Announces 2023 Annual Results Solid Performance for Advanced Packaging
- ASMPT Announces 2023 Third Quarter Results Advanced Packaging A Bright Spot Amidst Weak Industry Conditions
- ASMPT Announces 2023 Interim Results Q2 2023 Revenue Above Mid-point of Guidance Positioned Well for Generative AI and HPC Growth
- ASMPT Announces 2023 First Quarter Results Q1 2023 Revenue Above Mid-point of Guidance Despite Challenging Macro Environment