FIREBIRD TCB
Paving the Future of Advanced Packaging for AI and HPC
The Solution for the Next Generation of Semiconductors: FIREBIRD TCB
The FIREBIRD TCB is a state-of-the-art thermo-compression bonding system specifically designed for heterogeneous integration in 2D, 2.5D and 3D formats. This technology enables advanced packaging solutions with exceptional precision and flexibility, making it ideal for next generation semiconductor applications. With a placement accuracy of ±2.0 μm and handling cycle times under 2 seconds, the FIREBIRD TCB is designed to meet the demanding requirements of high performance computing and AI applications.
Key Features for Future-Ready Manufacturing
- Advanced Materials Handling
The FIREBIRD TCB offers unprecedented flexibility in materials handling, supporting co-existing die input from both wafer and tape & reel formats. Its field-configurable design accommodates strip, singulated, and wafer substrates, while the ultra-wide carrier handling capability ensures versatility across different packaging requirements. - Precision and Performance
Precision is crucial for advanced packaging applications. The FIREBIRD TCB achieves angular accuracy of ±0.01° for larger dies and ±0.05° for smaller ones, with co-planarity of 3 μm over 33 mm. This exceptional precision makes it ideal for CPU, GPU, and Hybrid Memory with TSV applications. - Innovative Process Control
The system features an inert environment that enables Liquid Phase Contact (LPC) for high productivity. Real-time active tip tilt control ensures optimal bonding results, while the dual-range bond force system (0.1-30N / 30-300N) provides the flexibility you need for various applications. - Advanced Thermal Management
Equipped with pulse heating nozzle technology capable of temperatures up to 400°C, the FIREBIRD TCB ensures precise thermal control during the bonding process. This feature is crucial for maintaining bond quality and preventing substrate warpage
Shaping the Future of Semiconductor Integration
With over 250 sets installed in mass production worldwide, the FIREBIRD TCB has proven its reliability and effectiveness in advanced packaging applications
As the semiconductor industry moves toward more complex integration requirements, the FIREBIRD TCB's precision and versatility position it as a key enabler for next-generation semiconductor devices.
ASMPT’s advanced packaging solution FIREBIRD drives heterogeneous integration forward, enabling next-generation high-performance computing and AI applications through innovative bonding technology.