ALSI LASER1205
The Future of SiC Wafer Separation
Shaping the Future of Power Electronics
This cutting-edge multi-beam laser dicing platform sets new standards in wafer separation technology. Engineered for silicon carbide (SiC) and other advanced semiconductor materials, this innovative system delivers precision and performance that is unparalleled in the industry. It is the solution for the growing demands of power electronics and high-efficiency applications.Key Features for Next-Generation Manufacturing
Exceptional Precision and Efficiency
The ALSI LASER1205's patented V-shaped Diffractive Optical Element (V-DOE) technology is the heart of its innovation. This revolutionary approach splits the laser beam into multiple sub-beams, enabling simultaneous processing of different wafer areas while minimising the Heat Affected Zone (HAZ). The result is superior die strength ranging from 450 to 500 MPa, setting new industry standards for quality and reliability.
With positioning accuracies of less than 1.5 microns and cutting widths of less than 12 microns on 100 micron silicon, the ALSI LASER1205 achieves remarkable precision while operating 50% faster than traditional methods. The system efficiently processes wafers from 10 to 250 microns thick, making it ideal for a variety of power electronics manufacturing applications.
Versatile Processing Capabilities
The platform supports multiple processing options including:
- Full cut dicing and grooving
- Processing of thin Si MOSFET & IGBT
- SiC MOSFET & IGBT manufacturing
- GaN on Si or SiC applications
- Advanced Control Systems
Equipped with inline vision and kerf check capabilities, the ALSI LASER1205 ensures consistent quality through real-time monitoring and adjustment. The system's "On-The-Fly" processing capability maximizes throughput while maintaining precise control over all critical parameters.
Shaping the Future of Power Electronics
As silicon carbide becomes increasingly crucial for energy transition and high-efficiency power electronics, the ALSI LASER1205 stands at the forefront of enabling this technological evolution. Its ability to process sensitive materials with unprecedented precision and efficiency makes it an essential tool for manufacturers developing next-generation power devices, from high-efficiency inverters to advanced automotive applications.
The ALSI LASER1205 advances the production of more efficient and compact power electronics, driving the future of sustainable technology.