LITHOBOLT™
Next Evolution of IC Interconnect Solutions for Heterogeneous Integration
Bringing Advanced Packaging to the Next Level with Ultra-Precision Hybrid Bonding
The LITHOBOLT™ represents the new standard in die-to-wafer hybrid bonding technology, designed to meet the demands of next-generation semiconductor packaging. This fully automatic system operates in a class 1 (ISO 3) clean environment, delivering unparalleled precision for advanced packaging in AI, high-performance computing, and 5G applications.Key Features for Future-Ready Manufacturing.
Advanced Hybrid Bonding Technology
The LITHOBOLT™ enables direct copper-to-copper connections without solder or flux, revolutionizing the way chiplets are integrated. Operating in a highly clean environment, it supports both die face-up and face-down applications, making it versatile for various advanced packaging requirements.
Versatile Processing Capabilities
The platform supports multiple processing options including:
- Ultra-Precision Integration
Precision is the absolute key to heterogeneous integration in semiconductor technology. The LITHOBOLT™ is the ideal solution for high-volume production environments, handling 12-inch wafers with OHT FOUP input with unparalleled efficiency. - Flexible Production Solutions
The system can be integrated into a line format with up to six machines, offering scalable production capacity. It is flexible enough to be integrated into any production line. This flexibility allows manufacturers to optimise their production flow while maintaining consistent bonding quality across all processes. - Advanced Process Control
The fully automated process ensures precise control and repeatability, crucial for achieving consistent results in die-to-wafer hybrid bonding. This automation enhances both productivity and yield while reducing the risk of human error.
Equipped with inline vision and kerf check capabilities, the ALSI LASER1205 ensures consistent quality through real-time monitoring and adjustment. The system's "On-The-Fly" processing capability maximizes throughput while maintaining precise control over all critical parameters.
The LITHOBOLT™ is the future of semiconductor integration. The LITHOBOLT™ is essential for the redesign of system-on-chip (SoC) devices into 3D stacked chips via chiplet technology. Combining chips with different process nodes into advanced packaging systems powers new applications in artificial intelligence, high-performance computing, and 5G communications.
In collaboration with industry leaders like IBM, the LITHOBOLT™ has delivered significant improvements in bonding quality between chiplets, enabling more reliable and efficient mass production. This technology is not just a bonding solution. It is a strategic innovation that will shape the future of semiconductor packaging and heterogeneous integration.