AMICRA NANO
Hybrid Bonding for Co-Packaged Optics
Revolutionizing Data Transmission with Precision Bonding Technology
The AMICRA NANO is a cutting-edge die and flip-chip bonder, specifically engineered for the production of co-packaged optics. This technology integrates optical and electronic components into a single housing, offering a high-precision solution for the data communication needs of tomorrow. With a placement accuracy of ±0.2 μm and unparalleled process stability, the AMICRA NANO is designed to meet the growing demands of high-performance data centers and networks.
Key Features for Future-Ready Manufacturing
- Hybrid Bonding for High-Density Data
Co-packaged optics manufacturing is critical for creating compact, miniaturized components, which are essential for high-performance data transmission in modern data centers. The close integration of chips and optical interfaces reduces latency and increases energy efficiency. The AMICRA NANO tackles the challenges of increasing semiconductor complexity with its innovative hybrid bonding technology, which ensures stable mechanical and electrical connections without the need for solder or glue. - Exceptional Precision for Miniaturization
Precision is paramount for miniaturization in semiconductor technology. The AMICRA NANO achieves a placement accuracy of ±0.2 µm and supports bonding forces ranging from 0.1 to 20 N, processing up to 400 components per hour. This makes it an ideal solution for high-mix/low-volume production, including prototypes and small batches. - Advanced Camera and Monitoring Systems
Equipped with four high-resolution cameras, the AMICRA NANO monitors each stage of the bonding process, ensuring precise alignment and final inspection. Its design allows real-time monitoring of both the die and substrate through the bond head. Additionally, an infrared illumination system enhances visibility by penetrating the dies during placement. - Ultra-Clean Process Environment
Maintaining a contaminant-free environment is crucial for delicate bonding processes. The AMICRA NANO features a HEPA filtering and ionization system to ensure high-purity conditions, further enhancing its flexibility for handling various bonding methods such as laser soldering and UV curing.
Flexible Technology for a Range of Applications
The AMICRA NANO’s flexibility extends to supporting direct and indirect hybrid bonding as well as various soldering and gluing processes. This versatility, coupled with three heating options, makes it a powerful tool for a wide range of applications, including high-performance computing, quantum computing, AI systems, IoT devices, and autonomous vehicles.
Shaping the Future of Data Centers
Hybrid bonding is essential for next-generation technologies where maximum performance in minimal space is crucial. As optical and electronic signal conversion becomes more important, the AMICRA NANO’s precision in placing light-emitting and light-sensitive components positions it as a key player in the evolution of high-speed data communication systems.
The AMICRA NANO is more than just a bonding machine – it's a strategic innovation for the future of data transmission and high-performance technology.