SIPLACE CA2
SMT and DIE Bonding in one Machine
Bringing Semiconductor and SMT Technologies Together
The SIPLACE CA2 is a revolutionary hybrid placement machine designed to meet the increasing demands for compact, high-performance components in applications such as automotive, 5G/6G, and smart devices. By integrating semiconductor die and surface-mount technology (SMT) production into a single machine, the SIPLACE CA2 enables the seamless production of System-in-Package (SiP) modules directly on the SMT line.
Key Features for High-Volume, High-Precision Manufacturing
- Combined Semiconductor and SMT Production
The SIPLACE CA2 processes both SMDs from tapes and dies directly from wafers in one step, achieving speeds of up to 54,000 dies or 76,000 SMT components per hour. This integration enhances productivity and reduces the need for separate processes, saving valuable time and floor space. - High-Speed, Accurate Placement
With a precision of up to 10 microns @ 3 σ, the SIPLACE CA2 delivers exceptional placement accuracy. Its advanced buffer system allows for continuous die placement while separating the wafer pickup process, significantly improving speed and efficiency. - Sustainability and Cost Savings
By eliminating the need for die packaging tapes, the SIPLACE CA2 reduces material waste and lowers production costs. Manufacturers can save up to 800 km of tape per year, making it a cost-effective and environmentally friendly solution for 24/7 SiP production. - Full Wafer Handling Flexibility
The machine's wafer exchange system holds up to 50 different wafers, with a swap time of just 10 seconds. This flexibility allows manufacturers to quickly adapt to different production requirements, making it ideal for high-volume operations.
Advanced Packaging for a Range of Industries
The SIPLACE CA2 is designed to support the demands of advanced packaging in industries such as consumer electronics, automotive, and telecommunications. Its ability to combine high-precision semiconductor processing with SMT placement makes it a powerful solution for manufacturers looking to enhance productivity and reduce costs.
The SIPLACE CA2 is more than just a placement machine – it’s a game-changing innovation for the future of semiconductor and SMT production.