Innovative Solutions for a Broad Range of Applications
Our semiconductor assembly and packaging solutions cover a variety of industries, encompass a broad spectrum of semiconductor components like GPUs, memory chips, integrated circuits (IC), sensors, LEDs and laser diode which serve as the backbone for powering devices and systems in computing, servers, automotive, industrial, communications, and consumer applications. In addition to traditional processes like die bonding, flip-chip bonding, wire ball bonding, molding, and sintering, we deliver cutting-edge Advanced Packaging solutions for chiplet integration, enhancing efficiency and performance to drive progress in the AI era. Beyond meeting industry performance standards, we also offer software solutions for system-to-system and system-to-factory integration, focusing on line integration automation.
On the Cutting Edge
We have a global footprint with a strong R&D capability that ensures we stay at the forefront of innovation and technology process expertise. Our solutions encompass quality, performance, reliability and innovation that customers adopt from technology roadmap development through to high-volume mass production. Our customers are our partners with whom we collaborate and serve to go to market together.